BGA Rework Station2023-09-21T07:52:04+00:00

Reliable BGA Rework Station for All Your PCB Needs

ElectronicsTalk can provide 4 types of BGA rework stations, which are the desktop BRS-410, full-auto BRS-550, large board BRS-650, and the floor-standing BRS-660. Each of the model owns a high-accuracy temperature control with simulating the soldering process of reflow oven, which improves the efficiency of component reworks.

A BGA (Ball Grid Array) rework station is a specialized tool used for repairing and replacing BGA components on printed circuit boards (PCBs). BGA components have solder balls on the bottom that connect to the PCB, rather than leads that go through holes in the board. A BGA rework station uses controlled heat and specialized tools to safely remove and replace BGA components without damaging the PCB.

What is a BGA rework station?

A BGA rework station consists of a platform to hold the PCB, a microscope to view the work area, a heating element such as a hot air pencil to melt the solder, and vacuum pickup tools to remove and replace components. The platform often has a split design to allow access to both sides of the board.

How does a BGA rework station work?

The main steps in using a BGA rework station are:

  1. Secure the PCB to the platform and align it under the microscope.
  2. Use the hot air pencil to evenly heat all solder joints of the BGA component until the solder melts.
  3. Use a vacuum pickup tool to lift off the old BGA component.
  4. Clean any residual solder from the PCB pads using solder wick.
  5. Apply flux to prepare the pads for the new component.
  6. Use solder paste or balls to attach the new component.
  7. Carefully place the new component onto the prepared pads.
  8. Heat again so the solder reflows to form the joint.

Why use a BGA rework station?

The precision control and specialized tools of a BGA rework station enable safe, high-quality BGA repairs and replacements that would be extremely difficult with basic soldering equipment.

The different types of BGA rework stations

There are various configurations of BGA rework stations providing different levels of control, automation, and features. More advanced stations may have features like split optics, infrared heating, and automated pick and place tools.

Benefits of using a BGA rework station

Using a proper BGA rework station provides many advantages over attempting BGA work without the right equipment:

Improve the quality of PCBs

The specialized heating and vacuum tools of a rework station prevent damage and give higher quality solder joints than manual techniques.

Reduce the cost of manufacturing

Reworking BGAs avoids the need to scrap PCBs due to damaged components, reducing waste.

Increase the lifespan of PCBs

Proper reworking extends the usable lifespan of PCB assemblies by enabling repairs and upgrades.

Optimize production processes

The ability to safely rework BGAs without damaging boards saves time and streamlines production.

How to choose a BGA rework station

Important factors to consider when selecting a BGA rework station include:

Factors to consider

  • Type of heating element (hot air, infrared)
  • Vacuum pickup tool range
  • Microscope quality and zoom capability
  • Platform size and PCB holding method
  • Degree of temperature control
  • Budget

Different types of BGA rework stations

  • Basic – Lower cost station with simple hot air pencil and basic microscope
  • Professional – Mid-range model with standard features
  • Advanced – High-end station with split optics, automation, and advanced features
bga rewrok station brs 410 machine picture

Semi-Auto BGA Machine


BGA rework stations range from around $1,000 for entry-level models to over $10,000 for advanced automated stations.


What is the difference between WLCSP and BGA?2023-07-28T06:24:55+00:00
WLCSP (wafer-level chip-scale package) places contacts on the active side of the silicon die. BGA (ball grid array) places solder balls on the bottom of the package that contains the die. WLCSP avoids a package substrate for further size reduction.
What are the benefits of BGA?2023-07-28T06:24:23+00:00
Benefits of BGA packages include high density interconnects, improved electrical performance, reduced package size, and short routing distances.
What are BGA components?2023-07-28T06:23:46+00:00
BGA components are integrated circuits or chips that have solder ball connectors on the bottom surface in a grid pattern. The balls align with matching pads on a PCB to form soldered connections.
What are the disadvantages of BGA?2023-07-28T06:23:09+00:00
Disadvantages of BGA components include being difficult to inspect solder joints visually, requiring specialized rework tools, and having limited repairability compared to through-hole components.
What is the meaning of BGA?2023-07-28T06:22:37+00:00
BGA stands for Ball Grid Array. It is a surface-mount packaging method for integrated circuits that uses a grid of solder balls on the bottom of the chip to connect to the PCB.
What is rework station used for?2023-07-28T06:21:55+00:00
A rework station allows repairing and replacing damaged components on printed circuit board assemblies. They are used to safely remove soldered components like chips and connectors and solder new components without damaging the board.
What is BGA workstation and its application?2023-07-28T06:21:14+00:00
A BGA workstation is a specialized tool used to rework or repair BGA (Ball Grid Array) components on printed circuit boards. BGAs have solder balls on the underside rather than leads, requiring specialized heat and vacuum tools to remove and replace them.
How do you rework a BGA?2023-07-28T06:20:40+00:00
BGA components are reworked using a BGA rework station. The key steps involve heating the solder joints to melt the solder, removing the BGA chip with a vacuum tool, cleaning the pads, applying new solder, placing the new BGA component, and reheating to form the solder joints.


Using a proper BGA rework station has many benefits for electronics manufacturing including improved quality, reduced costs, optimized production, and extended PCB lifespan. Carefully evaluating factors like heating methods, tooling, and budget will ensure selecting the right BGA rework station for your needs and processes. Proper tools enable efficient, high-quality BGA reworks and repairs.

Basic Description BGA Rework Station

There are four models available for the BGA rework station offered by ElectronicsTalk. First, the desktop BGA rework station is the cost-effective one and is suitable for small size of PCB board with high optical positioning accuracy and great heating method.

Second, the full-auto models of BRS-550 has a higher automatic operation than previous one. And when aligning, its lens can be moved forwards, backwards, left, and right to observe the periphery of the chip without dead spots.

Third, the BRS-650 is used for larger size of board and can mount bigger IC components. Besides, adding more sensors, motion motors, and use of higher pixel of camera meets a higher production requirements.

Lastly, the floor-standing model has the highest configuration with best heating system, flexible optical alignment system, and high-level of automatic operation.

Learning Has No Limits

ElectronicsTalk aware of this philosophy all the time, like the over 2 decades we are still serving countless individual for their PCB assebly business, check the guide we prepared here for BGA Rework Station.

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