soldering machine reflow oven 5 zone

IR Reflow Oven

The IR reflow oven is suitable for infrared radiation curing of the surface coating of the PCB board. This model of IR3C can just meet the curing requirements in the surface spraying process of the PCB board.

It is not only simple in structure, fast curing speed, high production efficiency, but also can reduce production space and has good curing quality. It has become an advanced IR reflow oven in the world.

Customization is always available, please mark down your need when contact us.

Features Of IR Reflow Oven

1. Control Panel System

  • It uses a convenient and simple control panel, which is easy to operate for this IR reflow oven.
soldering machine reflow oven feature control panel system

2. Heating System

  • Adopt the PLC temperature controller and button control, it can achieve precise temperature control in 2 temperature zones.
  • Equipped with 2 temperature zones, it has 6 heating pipes in each temperature zone, to minimize energy consumption.

2. Heating System

  • Adopt the PLC temperature controller and button control, it can achieve precise temperature control in 2 temperature zones.
  • Equipped with 2 temperature zones, it has 6 heating pipes in each temperature zone, to minimize energy consumption.
pcb conformal coating ir reflow oven feature heating system

3. Transportation System

  • Use of chain conveyor mode, the width of the chains can be adjusted between 50-450mm.
  • In order to meet the customer’s multiple connection ways, the chain uses stainless steel and an extended pin chain.

4. Guide Rail Structure

  • It is adopted with the specially reinforced aluminum alloy guide rail which can withstand high temperatures.
  • Also, the guide rail supports an adjustment mechanism to ensure minimum deformation.
  • The shaking problem of the track is avoided, and eliminate the dropping issue of the PCB board.

5. Adjustable Transportation Speed

  • Adopt specially reinforced aluminum alloy guide rails, which can withstand high temperatures and cooperate with the support adjustment mechanism to ensure the minimum amount of deformation.
  • The track is prohibited from shaking, and the phenomenon of failing off the board is eliminated.

Infrared Reflow Oven

IR (infrared) reflow ovens utilize infrared radiation to heat printed circuit boards (PCBs) and solder assembly components for reflow soldering. The intense infrared energy allows rapid and targeted heating needed to form high quality solder joints. IR reflow provides advantages in certain applications, but also has some limitations to consider.

Key Features of IR Reflow Ovens

IR reflow ovens contain the following distinguishing features:

Infrared Heating Elements

IR ovens use infrared emitters like quartz halogen lamps instead of traditional convection or conduction heating elements. These heat the boards and components directly and rapidly.

Rapid Heating

Infrared radiation allows very fast heating, reducing reflow cycle times. However, this can also lead to thermal shock if not properly managed.

Temperature Controls

Specialized pyrometers monitor temperatures and adjust the infrared output as needed to follow reflow profiles.

Smaller Size

IR ovens take up less space since the infrared emitters provide targeted heating without large surrounding ovens.

Advantages of IR Reflow Ovens

Some benefits that IR reflow ovens provide:

Fast Process Speed

The rapid infrared heating greatly reduces soldering cycle times.

Energy Efficiency

Less energy is wasted compared to heating an entire convection oven.

Flexible and Adaptable

Different IR emitters allow tuning the process for specific board designs.

Improved Solder Joint Quality

Faster reflow ramps can reduce soldering defects in some cases.

Limitations of IR Reflow Ovens

Some drawbacks and limitations include:

Higher Cost

The specialized emitters and controls make IR ovens more expensive than convection ovens.

Limited Board Size

Most IR ovens have smaller chamber sizes which limits board dimensions.

Complex Profile Tuning

The fast heating dynamics require more complex profile tuning to avoid defects.

Comparison to Convection and Hot Air Ovens

IR ovens differ from convection and hot air ovens in:

Heating Method: Infrared vs hot air or convection heating

Speed: Much faster process times with infrared

Board Size: Typically smaller maximum board size

Evenness: More tuning required for uniform heating

Cost: More expensive than convection ovens

Selecting an IR Reflow Oven

Key factors when selecting an IR reflow oven:

Production Volume

High volume manufacturing may require a convection oven. IR suits low to medium volumes.

Board Size

Ensure the oven can accommodate the board dimensions.


IR ovens range from $5000 to $50,000+ depending on size and features.

Experience Level

The complexity of IR ovens may require experienced users.

Using IR Reflow Ovens

To use an IR reflow oven effectively:

Loading Boards

Use proper fixturing to hold boards in place during rapid heating.

Profile Creation

Develop and tune custom temperature profiles for each board design.

Process Monitoring

Monitor and inspect the reflow process closely to catch any issues.

Cool Down

Controlled cooling is critical to avoid damage from thermal shock.

Case Studies of IR Reflow Ovens in Manufacturing

An electronics manufacturer used IR reflow to solder high mix/low volume boards with fine pitch components. The fast ramp speeds resulted in excellent solder joint quality.

A medical device company used IR reflow to solder temperature sensitive components onto flexible PCBs without damage. The targeted heating prevented warping.

Safety Considerations for IR Ovens

Important safety practices for IR reflow ovens:

Protect operators from direct IR exposure

Provide adequate ventilation for fumes

Follow electrical and fire safety precautions

Allow boards to cool fully before handling

Specification Of Infrared Reflow Oven

PCB Transfer Height920 +/- 20mm
Transportation Speed0-3500mm/min
Transfer DirectionL to R (R to L)
Transmission MotorStepper motor
Delivery MethodChain conveyor (35B5 extended stainless steel chain)
Electric Current10A
Number of Heating Pipes12 units, 6 pipes each zone
Number of Temperature Zones2 zones
Type of PipesInfrared quartz heating pipe
Adjustable Range of TemperatureCustomized temperature-150 degree
Heating TimeLess than 10 minutes
Max. PCB Board SizeW450mm*L450mm
Max. PCB Component Height+/- 100mm
Opening MethodAutomatic lifting
Power SupplyAC380V 50HZ
Total Power6.5KW

Dimension Of Infrared Reflow Oven

Dimension (LxWxH, mm)2000x1080mmx1300
Weight (Kg)500


IR reflow ovens provide faster reflow cycles along with energy efficiency and adaptability benefits. When applied appropriately for the right production needs, IR ovens can enhance soldering quality and throughput. However, the limitations around board size, cost, and tuning complexity must also be factored in. With careful selection and use, manufacturers can leverage IR reflow ovens for optimized small-scale to medium-scale production.

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