Sealed Hamamatsu X-Ray Source 90KV
Overview of Hamamatsu X-Ray
The Hamamatsu Microfocus X-ray sources were developed particularly for
X-ray non-destructive inspection system. These X-ray sources use an X-ray
tube with a small focal spot of several micro-meters to 10 micro-meters,
capable of producing a clear X-ray image even at a high magnification. The
RS-232C interface is provided as a standard feature,allowing automatic
operation by external control.
The X-ray tube has an air-cooled and hermetically sealed structure, and
is integrated with its high voltage power supply for easy handling.
(High voltage cables are not required.)
BGA , CSP , Flip Chip, LED , Fuse, Diode, Sensors, PCB Voids
Semiconductor , Battery Industry , Small Metal Casting, Electronics
Cables and Connectors, 3D Printing Module, Medical Device and Parts.
Hamamatsu X-Ray Source Features:
- Focal Spot Size: 5 μm, enables sharp and clear X-ray images even at a high magnification
- Easy Handling: fully operable from an external PC
One package of a sealed type X-ray tube, a high-voltage power supply and
- a control function
Voltage and Current Range
Specification of Hamamatsu X-Ray
||Description / Value
|Input Voltage (DC)
|Power Consumption (Max.)
|Operating Ambient Temperature
||+10 to +40
||0 to +50
|Operating and Storage Humidity
||Below 85 (No Condensation)
||CE (EMC: IEC 61326-1, Group1, Class A)
|High Voltage Power Supply
||Description / Value
|X-ray Tube Cooling Method
|X-ray Tube Window Material / Thickness
||Beryllium / 150
|Tube Voltage Operational Range
||40 to 90
|Tube Current Operational Range 1
||10 to 200 (8 W Max.)
|X-ray Focal Spot Size
||7 (5 μm at 4 W)
|X-ray Beam Angle (Coned)
|Focus to Object Distance (FOD)
|X-RAY CONTROL PART
||Tube Voltage and Tube Current Preset / Auto Warm-up
||Windows® 2000 Professional, XP Professional
|Computer Operating Conditions
||CPU: Intel Pentium or Higher, Memory: 64 MB or More
The Benefits of Using X-Ray PCB Inspection Machines
Here is a summary of some of the key benefits of using X-ray PCB inspection machines:
- High-resolution imaging allows the detection of microscopic defects – X-rays can penetrate boards and components, revealing issues like cracks, voids, missing connections, or foreign objects that visual inspection would miss. Resolution down to a few microns is possible.
- Rapid whole-board inspection – X-ray imaging allows the entire board to be scanned at once, rather than inspecting individual sections visually. This allows for faster throughput and detection of defects across the entire board.
- Repeatability and objectivity – Machine inspection is consistent and objective, while manual visual inspection can vary between operators. This improves quality control.
- 3D inspection capability – Some X-ray systems generate 3D models of boards and components, allowing more thorough inspection from all angles.
- Wide range of board sizes – Small boards and large panels can be accommodated by adjusting the X-ray camera setup. No size limitations like with optical inspection.
- Material agnostic – X-rays penetrate metals, plastics, ceramics, etc allowing inspection of complex multi-material boards. Component type and board thickness have minimal impact.
- Detects issues like solder defects, contaminants, and placement accuracy – Besides physical defects, X-rays can identify botched solder joints, unwanted foreign objects, misalignments, and more.
The combination of high resolution, rapid throughput, and ability to detect minute defects makes X-ray invaluable for quality control in electronics manufacturing. Implementing X-ray inspection improves product quality and reliability.
The different factors to consider when choosing an X-ray PCB inspection machine
Here are some key factors to consider when selecting an X-ray PCB inspection machine:
- Image resolution – Higher resolution allows seeing smaller defects. Typically measured in microns. Sub-micron resolution is best.
- X-ray source power – Higher power allows the penetrating of thicker and denser boards. 30-160kV sources are common.
- Detector technology – Newer CMOS detectors offer faster scanning and lower noise than CCDs. Resolution and pixel size are also factors.
- Size and thickness capacity – Machines differ in the maximum PCB size and thickness they can handle. Pick one that matches your products.
- Conveyor speed – Faster conveyors mean higher throughput. Important for high volume production. Speeds from 10-200mm/second are typical.
- Software capabilities – Software for analyzing images, defect detection, generating reports, etc. Should have sufficient analysis tools.
- 3D inspection – Some systems offer 3D scanning capability for thorough inspection. Useful for complex boards.
- Price – Initial cost plus ongoing maintenance and consumable costs. Balance capabilities with budget.
- Footprint – Larger systems take up more factory floor space. Consider available space.
- Ease of use – Software and controls should be intuitive for operators. Extensive training adds costs.
- Company reputation and support – Established vendors offer better support and are less risky.
Considering these factors will help identify the right X-ray system that meets inspection requirements within budget constraints.
The latest trends in X-ray PCB inspection machines
Here are some of the latest trends emerging in X-ray PCB inspection machine technology:
- Higher resolutions – Newer microfocus X-ray sources allow sub-micron resolution imaging to detect even microscopic defects.
- Faster line scan rates – High speed line scan cameras reach speeds of over 200mm/second conveyor movement allowing rapid inspection.
- Integrated 3D inspection – 3D X-ray imaging is being integrated into inspection processes for complete board visualization.
- AI-enabled defect recognition – Machine learning is being applied to automate analysis and identify defects without operator input.
- Large panel inspection – Larger conveyors and scanning areas are being developed to handle PCB panels over 2×2 feet.
- Dual angle inspection – Adding ability to scan boards from multiple angles gives more complete inspection.
- Inline integration – X-ray systems are being integrated into manufacturing lines for live in-process quality control.
- Cloud-based imaging – Scanned images are being uploaded to the cloud for remote analysis and data analytics.
- Virtual reality visualization – Scanned 3D board data can be viewed and manipulated in VR for immersive inspection.
- Automated reporting tools – Systems generate inspection reports, trends and analysis without extensive manual work.
These trends aim to make X-ray inspection higher resolution, faster, more automated and a seamless part of the manufacturing process. This allows maximizing quality and minimizing defects.