The BRS-550 is the upgraded model of BRS-410, with higher working efficiency and capability. Moreover, with fully automatic operation and high precision, it can completely avoid human operation errors. Also, it can achieve better results for the lead-free process and double-layer BGA, QFN, QFP, capacitor resistance, and other components
Second, this bga soldering machine has a larger PCB size capability, which can cover more products. Lastly, the machine can be used for a wider BGA size range, in which the maximum length can up to 80mm. More importantly, it has a 6-stage constant temperature heating mode, which improves the efficiency of chip repair.
Adopting the precise optical alignment system and chip angle adjustment system, the placement accuracy reaches 10 microns. With three independent temperature zones, it uses the PLC and closed-loop control, the temperature control accuracy is within 1℃, make sure the high standard of heating effect. This machine also achieves a highly automatic operation, which is convenient and simple.