Electronics X-ray Inspection | HT100:

Introducing our another cutting-edge inspection system designed to detect welding defects in electronic components, providing unparalleled accuracy and reliability for quality assurance.

Functions and Features

• Versatile Application: Ideal for detecting welding defects in PCB, SMT assembly, IC packaging, BGA, CSP, and semiconductor components.
• High Accuracy: Delivers precise and reliable defect detection to ensure the highest quality standards in electronic manufacturing.
• Comprehensive Coverage: Thoroughly inspects a wide variety of electronic components to identify and address potential issues early in the production process.

Electronics X-ray Inspection | HT100L:

Experience the precision and reliability of our X-ray detection system, designed for use in semiconductor, SMT, DIP, and various electronic component inspections, including IC, BGA, CSP, and flip chips.

Functions and Features

• Versatile Detection: Suitable for inspecting semiconductors, SMT, DIP, electronic components, ICs, BGAs, CSPs, and flip chips.
• High-Resolution Imaging: Equipped with high-resolution FPD to obtain high-quality images, capable of detecting defects as small as 2µm.
• Automatic Positioning: Features CNC programming for automatic positioning and 45° tilt detection with a small opening angle.
• Enhanced Imaging: Real-time navigation imaging and HDR image enhancement function ensure clear and detailed visual output.
• Comprehensive Measurement Tools: Includes tools for measuring size, area, angle, and curvature, facilitating thorough inspection and analysis.

Electronics X-ray Inspection | HT300L:

Our advanced X-ray detection system is engineered for semiconductor, SMT, DIP, and a variety of electronic components, including ICs, BGA, CSP, and flip chips, delivering unparalleled precision and efficiency.

Functions and Features

• Wide Range of Applications: Designed for semiconductor, SMT, DIP, electronic components, IC, BGA, CSP, and flip chip inspections.
• High-Quality Imaging: Utilizes high-resolution FPD to capture superior quality images, detecting defects as small as 2µm.
• Automatic Positioning: CNC programming allows for automatic positioning and a 45° tilt detection with a small opening angle for comprehensive inspections.
• Enhanced Visualization: Real-time navigation imaging paired with HDR image enhancement provides clear and detailed images.
• Advanced Measurement Tools: Equipped with tools to measure size, area, angle, and curvature, ensuring accurate and thorough inspection results.

Electronics X-ray Inspection | HT300:

Discover our high-performance inspection system, designed to meet universal inspection requirements with a strong penetrating ray source and HD FPD, ensuring comprehensive and accurate detection for various applications.

Functions of HT300

• Powerful Penetration: Equipped with a strong penetrating ray source combined with HD FPD to deliver clear and detailed inspection results.
• Comprehensive Control: The detector tilts 70°, and the stage rotates 360° horizontally, with six-axis linkage providing all-round control and detection capabilities.
• High-Definition Navigation: Features high definition navigation images for fast and precise product positioning.
• Advanced Imaging and Measurement: Configured with HDR image enhancement and equipped with measurement tools for size, area, angular curvature, and more, ensuring thorough and accurate inspection.

Features of HT300

• Top-Tier X-Ray Tube: Equipped with American Thermofisher’s closed-type X-ray tube, boasting over 10,000 hours of lifespan and unmatched reliability, perfect for precise inspections of electronic components, circuit boards, and solder joints.

• HD Digital Flat Panel Detector (FPD): Upgrade to ELT’s latest HD digital FPD for exceptional image quality without the need for an image intensifier. Ideal for both medical and industrial applications, ensuring clear, high-resolution imaging.
• Flexible Imaging: ELT’s FPD technology allows for a 70° tilt without sacrificing magnification, providing exceptional flexibility and accuracy for complex tasks, while eliminating the need for bulky tables and extra equipment.
• Advanced Navigation and Table Movement: Maximize efficiency with ELT’s automatic navigation window and advanced table movement technology, enabling precise positioning with a simple click and streamlining the workflow.
• Spacious and Sturdy Table: Featuring a 600*800 mm table with a 10 kg load capacity, our system provides ample space for diverse imaging tasks, ensuring clear and accurate results every time.
• Speed Adjustable 5-Axis Linkage System: Maintain central image positioning even when tilting, with adjustable speed for enhanced precision and reliable outcomes.
• Automated Inspection: Easily edit inspection procedures for automatic, large-scale inspections, achieving efficient and accurate results with minimal manual intervention.
• User-Friendly Operation: Quick defect detection with only 2 hours of training required, making it easy to operate and highly effective.

Choose ElectronicsTalk for cutting-edge, reliable imaging solutions that keep you ahead of the competition.

Electronics X-ray Inspection | MFX600LP:

Our advanced inspection equipment is specifically designed for detecting BGA and chip components, nickel plate detection on metal plates, and FPC welding parts. It efficiently calculates bubble percentages, measures size and area, and analyzes internal defects such as low tin and virtual soldering in products.

Functions and Features

• Orbital Online Inspection: Provides continuous, real-time inspection for seamless quality control.
• Automatic Detection and Analysis: Automatically detects and analyzes components for OK & NG classification, ensuring high accuracy.
• System Integration: Supports customized access to MES and ERP systems for streamlined data management.
• Precision Control: Features CNC programming for automatic positioning, ensuring precise and reliable inspection.
• Comprehensive Data Management: Includes a rework database management system that supports the review and generation of detailed data reports.