SMT Reflow Oven – 10 / 12 Zones

High production capacity, the normal production chain speed up to 1500mm/min, low energy consumption, new thermal engineering management system, effective reduction of cost, professional corresponding high precision production and high precision PCB process.

This type is our best SMT reflow oven, which ensures the ability of high temperature control, and you could found the setting temperature and actual temperature difference within + 1℃.

Super fast heating capacity, the difference of adjacent temperature difference is less than 100 degrees.

The latest insulation technology plus a new furnace design ensures that the furnace temperature zone can make the nitrogen concentration range 50 – 200 PPM (option).

Customization is always available, please mark down your need when contact us.

SMT Reflow Ovens

SMT (surface mount technology) reflow ovens are designed specifically for reflow soldering of surface mount devices (SMDs) onto printed circuit boards (PCBs). The precision heating and controls of SMT reflow ovens facilitate high-volume manufacturing of surface mount electronics.

Key Features and Components of SMT Reflow Ovens

SMT reflow ovens contain specialized features:

Heating Zones

Independent top and bottom zones ensure even PCB heating.

Heating Elements

High density infrared heaters allow rapid heating to soldering temperatures.

Conveyor System

A stable, programmable conveyor transports PCBs through the oven.

Temperature Control

Closed loop systems with thermocouples enable precise temperature profiles.

Cooling System

Active or passive cooling options are included for controlled PCB cool down.

Vision System

Alignment cameras fine tune PCB positioning in the oven.

Control Unit

The system controls all oven parameters and stores thermal profiles.

Advantages of SMT Reflow Ovens

Some benefits of SMT reflow ovens:

Efficiency

Automated reflow improves manufacturing efficiency and throughput.

Consistency

Precisely controlled profiles ensure repeatable, uniform soldering.

Versatility

Different profiles can be programmed to support various PCB assemblies.

Reduced Defects

Optimized thermal control minimizes many common soldering defects.

Considerations for SMT Reflow Ovens

However, there are some important factors to consider:

Profile Optimization

Profiles must be tuned for each unique PCB assembly.

Component Sensitivity

Components must be selected to withstand reflow temperatures.

Complexity

SMT reflow ovens are complex pieces of equipment requiring expertise.

Comparison to Convection and Hot Air Ovens

Some differences compared to convection and hot air ovens:

Faster heating with infrared elements vs convection or hot air

Enhanced cooling capabilities

Vision alignment systems

Capability to store and load thermal profiles

Zoned heating control

Smaller footprint

Selecting an SMT Reflow Oven

Key selection criteria for SMT reflow ovens:

Production Volume

Match system throughput speed to volumes and PCB sizes.

PCB Size

Choose an oven with adequate clearance for maximum PCB dimensions.

Component Types

Ensure oven can handle the range of component packages and densities.

Solder Paste Formulations

Consider oven compatibility with the various solder pastes used.

Using an SMT Reflow Oven

Best practices for effective SMT reflow oven usage:

Loading Boards

Use proper carrier frames and spacing between boards.

Setting Profiles

Optimize thermal profiles for each unique PCB assembly.

Monitoring Progress

Watch the reflow process closely for any potential issues.

Cool Down

Controlled cooling prevents damage from thermal stresses.

Troubleshooting

Identify and address the root causes of any soldering defects seen.

SMT Reflow Process Details

The SMT reflow process consists of:

Solder Paste Printing

Solder paste is printed on pads using stencils.

Component Placement

SMD components are precisely placed onto the solder paste.

Reflow

The assembly goes through the SMT reflow oven to melt the solder.

Inspection

Post-reflow inspection verifies joint quality and acceptable assemblies.

Applications of SMT Reflow Ovens

SMT reflow ovens are ubiquitous in fields like:

Telecommunications

Used extensively for reflowing routers, switches, and cellular infrastructure.

Consumer Electronics

Essential for high volume manufacturing of consumer electronics.

Automotive Electronics

Used to assemble engine control units, infotainment systems, sensors, etc.

Industrial Electronics

Important for manufacturing programmable logic controllers, instruments, etc.

SMT Reflow Oven Maintenance

To sustain performance, maintenance best practices include:

Regular calibrations of thermocouples and mechanisms

Periodic cleaning of optics, heaters, and conveyors

Component replacements as needed based on usage

Software and firmware updates

Daily and weekly preventive maintenance routines

Future Outlook for SMT Reflow Technology

Emerging trends shaping SMT reflow ovens:

Continued minimization of the reflow process window

Real-time defect recognition via advanced in-line inspection

Industry 4.0 integration for data collection and analytics

Growth of high-density component applications like wafer-level packaging

More environmentally friendly and energy efficient systems

Features Of SMT Reflow Oven

1. Central Support System (Option)

  • Ensure a stable and precise control of conveyor movement as well as preventing PCB deformation, enabling to support of the guide rail to maximally meet different requirements of soldering production.

2. Nitrogen System (Option)

  • Improving higher soldering quality by the way of decreasing oxidation during the process, can also solve the issues such as solder balls, and solder bridges and accelerate wetting speed.

3. Dual Rail System (Option)

  • Dual-rail production is optional, expanding double times of production capacity with the expenditure of one machine, which saves the SMT line footprint and other operating costs.

4. Patented Micro-circulation System

  • Micro-circulation systems ensure the average temperature in the furnace and can effectively reduce the influence of the temperature field on the welding spot.
  • It has a good performance in the same direction and different properties. It effectively solves the problems of unevenly distributed air in traditional filter networks. As a result, it can prevent the occurrence of non-heated areas and shadows resulting in reflection.

5. Cooling Technology

  • The latest cooling technology can be cooled by two sides. The maximum cooling length is 1100mm, which ensures fast cooling and minimum outlet temperature.

Specification Of SMT Reflow Oven

ModelRO-1200RO-1000
Heating Zone System
Number of Heating ZoneTop12/Bottom12Top10/Bottom10
Length of Heating Zone4560mm3860mm
Number of Cooling ZoneTop2/Bottom2Top2/Bottom2
Exhaust Volume11M3/minX211M3/minX2
Warming TimeApprox. 20minApprox. 20min
Conveying System
Maximum Width of PCB50-500mm50-500mm
Rail Width Range50-400mm50-400mm
PCB Component HeightTop30/Bottom25mmTop30/Bottom25mm
PCB Transmission AgentChain+MeshChain+Mesh
Conveying Speed0-2000mm/min0-2000mm/min
Conveying Height900+/-20mm900+/-20mm
Conveying DirectionL to R/R to LL to R/R to L
Conveyor Rail FixedFront rail fixed(option: rear rial fixed)Front rail fixed(option: rear rial fixed)
Control System
Temp-Control ModePID Full-closed loop control + SSR DriverPID Full-closed loop control + SSR Driver
Temp-Control RangeIndoor Temp-320 Celsius degreeIndoor Temp-320 Celsius degree
Temp-Control Accuracy+/- 1 Celsius degree+/- 1 Celsius degree
PCB Temp-Deviation+/- 2 Celsius degree+/- 2 Celsius degree
Cooling ModeForced wind cooling (chiller cooling optional)Forced wind cooling (chiller cooling optional)
Power System
Initial Power62KW56KW
Run Power12KW10KW
Power Requirement3Phase 380V 50/60HZ3Phase 380V 50/60HZ
Abnormal AlarmExtra-high temp or extra-low temp alarmExtra-high temp or extra-low temp alarm
Signal TowerThree lightThree light
Option
Nitrogen SystemNitrogen gas machine, machine type plus N, standard for nitrogen seal structure and pipeline, nitrogen flow meter, chillerOptional
Central SupportWith central support, no netOptional
Dual Rail TransportDual-rail model, plus D, standard for 1, 4 fixed and 2, 3 for active; PCB width is unilateral 250mmOptional

Dimension Of SMT Reflow Oven

ModelRO-1200RO-1000
Dimension (LxWxH,mm)6200x1400/1580x15505600x1400x1550
Weight (kg)24002200

Conclusion

SMT reflow ovens enable automated, high-precision reflow soldering essential for surface mount electronics manufacturing. When utilized properly, they provide efficiency, consistency, and reliability at high volumes. Selecting the right SMT reflow oven and following best practices for implementation and maintenance helps harness the benefits of these systems.

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