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Product category: Intellectual Property Cores
News Release from: TTPCom | Subject: Dual mode protocol stack
Edited by the Electronicstalk Editorial Team on 31 July 2006

First fully accredited
portable 3G protocol stack

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TTPCom's software is first portable 3G protocol stack to achieve full GCF and IOT accreditation

TTPCom has announces that its 3G dual-mode protocol technology has successfully passed GCF and IOT testing and is currently undergoing final carrier acceptance trials. As such, it represents the first multiplatform 2G/3G dual mode protocol software available on the open market to achieve this high level of certification.

TTPCom's dual mode protocol stack has already been integrated onto multiple silicon platforms from different vendors and is available now for license.

TTPCom has over a decade of experience in developing and licensing protocol software for 3GSM family devices.

This has resulted in a cellular stack with an efficient, small memory footprint.

Its single code base has evolved to encompass GSM, GPRS, EDGE, and WCDMA protocols, including HSDPA and is being extended to cover HSUPA and LTE.

'Now that our 3G technology has been independently accredited we aim to replicate the success we achieved in 2G, where our stack has powered over 100 million devices and is considered to be the defacto standard,' said Gordon Aspin, head of TTPCom's Wireless Systems division.

'Our expertise in this field has delivered an efficient, flexible and robust 3G solution which will provide the industry with a credible alternative to the platforms that have dominated early 3G handsets'.

H Hung, VP RandD of Asustek adds: 'A single software build of the TTPCom 3G protocol stack and Microsoft integration code has provided us with an excellent foundation for an entire 3G handset roadmap'.

'It is compact and portable and offers us more flexibility than ever before in silicon platform selection, making it an efficient and cost effective option'.

The TTPCom software system scales easily from low-cost, low-power single-chip 3G devices, to 3G feature phones based on TTPCom's AJAR Platform, through to high end devices such as Microsoft based smart phones or data cards with HSDPA capability.

According to Gwang Cheol Park, Vice President, RandD Division at Pantech Group: 'By selecting TTPCom's protocol stack, we will be able to develop a cellular phone that will set a new standard for 3G handsets'.

'We believe the partnership with TTPCom will bring a significant edge to our handsets'.

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