Alliance to develop dual-mode chips
TTPCom and NEC Electronics are joining forces to develop dual-mode chips that will include TTPCom's Edge/GPRS/GSM silicon and software architecture
This fast-track route to the development of 3G/2G chips will help NEC Electronics increase its presence in the global market. NEC Electronics is developing a dual-mode 3G/2G chipset to address the growing world market for dual-mode wireless products that can handover to Edge/GPRS/GSM networks outside pockets of 3G coverage.
'NEC Electronics is one of the leading developers of 3G technology in the world and we are therefore particularly pleased that we are working with them to incorporate our 2G/2.5G architecture into their dual-mode chips', stated Julian Hildersley, Managing Director of TTPCom's Silicon Business Unit.
'TTPCom has long recognised the pressure on R and D budgets in the wireless industry and its objective in silicon is to deliver stable solutions that save time and money by allowing customers to focus their R and D efforts on their strongest differentiators, and employ TTPCom's solutions when time-to-market is most important'.
'TTPCom's GSM/GPRS technology has become an industry standard, and the company is one of only a few companies to offer an effective Edge solution today', stated Masakazu Yamashina, General Manager, Mobile Systems Division, NEC Electronics.
'We were impressed with how easily we were able to integrate TTPCom's solutions with our own to develop dual mode 3G/2G baseband LSIs'.
'This has accelerated the delivery schedule for the chips and will have a significant impact on our ability to increase our presence in the global market'.
Kiyohide Ikeda, Country Manager TTPCom Japan added: 'With a long-standing involvement in the GSM market and in Japan, TTPCom is an ideal partner for companies looking to develop dual-mode products for the worldwide mobile market'.
'NEC Electronics will benefit from the proximity of a support team in Japan, and we look forward to a long and fruitful relationship'.
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