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SPP supplies Pegasus DSi Deep Silicon etch system

A SPP Process Technology Systems product story
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Edited by the Electronicstalk editorial team Jun 2, 2010

SPP Process Technology Systems (SPTS) has received an order for a Pegasus DSi Deep Silicon etch system, supported on the Omega FXP cluster platform, for a 3D-IC through silicon via (TSV) application.

The order was received from Fraunhofer IZM and is to be installed at All Silicon System Integration Dresden (ASSID).

The ASSID centre has been set up by Fraunhofer IZM Berlin to develop 3D wafer level technologies on 300mm wafers, enabling device manufacturers to apply 3D-IC technology in high-volume production to enhance the performance, functionality and scaling requirements of their future products.

The 300mm Pegasus DSi system will be used to etch deep through silicon vias and for wafer-thinning applications.

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