Assembly systems join in lead-free experience
Siemens Electronics Assembly Systems is supporting the SMART Group Lead-Free Experience at this year's Nepcon UK in Birmingham.
Siemens Electronics Assembly Systems has had a long association with the SMART Group and is supporting the SMART Group Lead-Free Experience at this year's Nepcon UK in Birmingham.
Siemens EA has always been very committed to supplying environmentally compatible products.
In responding to increasing market demands, respect for the environment is of the utmost priority to Siemens when designing and developing new products and in particular, new placement equipment.
As part of the Lead-Free Experience at Nepcon Birmingham, Siemens EA will be showing the recently launched Siplace X3 machine, producing lead-free printed circuit boards with a wide range of components.
The Siplace X-Series machines are capable of handling components from 01005 up to 85 x 85 or 125 x 10mm (200 x 125mm maximum) with an accuracy level of up to 30um at 4 Sigma.
The Siplace X3 machine is part of the innovative Siplace X-Series range, setting new standards in electronics manufacturing with respect to miniaturisation, compactness, speed and efficiency, as well as flexibility.
By equipping the Siplace X3 machine with two 20-nozzle high-speed heads and one 12-segment C and P head, medium volumes of small to super-small components can be processed.
Combined with the intelligent X-feeder modules and a Dual Transport system, such a machine would achieve a real placement performance of up to 41,000 components per hour while offering the highest flexibility.
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