Schroff hybrid system combines bus technologies

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Edited by the Electronicstalk editorial team Dec 11, 2009

Schroff has introduced a hybrid system that combines established bus formats such as VME or CompactPCI with MicroTCA in a single 3U-high, 19in subrack.

The hybrid system enables firms in this situation to work with two technologies in parallel.

Schroff has introduced a new hybrid system that combines established bus formats such as VME or CompactPCI with the emerging technology of MicroTCA in a single 3U-high 19in subrack.

Schroff has introduced a new hybrid system that combines established bus formats such as VME or CompactPCI with the emerging technology of MicroTCA in a single 3U-high 19in subrack.

One side of the subrack is equipped with conventional 19in components to accommodate 3U VME or 3U CompactPCI boards, while the other side consists of a MicroTCA board cage that accepts AdvancedMC single modules.

The board cage can be positioned left, right or centrally in the subrack and can have any chosen width.

The system is available with a through-connected monolithic backplane to maximise the number of free slots, or with two isolated backplanes connected via a front-panel PCIe data interface.

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