PCB connectors to go Pb-free
ODU will convert to lead-free finish for the soldered connections on its PCB connector products this year, which means that only pure tin will be used in the finishing process
This covers the company's Mini-Fix card-to-cable and Flakafix mass termination IDC products as well as its application specific custom designs. The change is ahead of the July 2006 European Directive 2002/95/EC that prohibits the use of lead, mercury, cadmium and hexavalent chromium in electrical and electronic products.
In accordance with future requirements the fundamental properties of these connectors will include lead-free surface finishing in the soldered connection area, high thermal stability up to 260C and they will be halogen free.
The company already uses halogen-free liquid crystal polymer (LCP) for the insulator materials for SMT and pin-in-paste variants because it has high temperature resistance and is UL flammability rated 94V0.
Now it will be standard for other products to comply with the lead free directive.
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