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Product category: Intellectual Property Cores
News Release from: M2000 | Subject: FlexEOS
Edited by the Electronicstalk Editorial Team on 7 February 2005

Embedded FPGA cores are
ready to run at 90nm

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M2000 FlexEOS embedded FPGA macros have now been production proven in 90nm CMOS technology and are ready for volume manufacture

At 90nm, M2000's high-performance FlexEOS eFPGA macro breaks the density barrier of 1000 reprogrammable lookup tables (LUTs) per square millimetre, with an intrinsic technology performance capable of 2.7GHz. It is also the industry's largest eFPGA with 98,304 LUTs, comparable to the high-end of the capacity range for commercial FPGAs.

'This achievement reinforces M2000's position as the leader in the embedded FPGA market', said In-Stat Principal Analyst, Jerry Worchel.

'The high density of FlexEOS eFPGAs expands the range of applications and products that can benefit from eFPGA functionality'.

'Field reprogrammable products are now within reach for ASIC designs, as well as platform ASICs for sizable volume production runs', Worchel continued.

'eFPGAs can be used in a wide variety of common functions where they would be programmed for multiple derivatives'.

'One example is the printer market, where one base design could be dynamically reprogrammed for many different applications'.

'We are very happy about the successful achievement of such a large, complex project'.

'It proves the viability of the technology, the software, and the integration methodology', said M2000 CEO Frederic Reblewski.

'A beta customer's own design team added a complex series of system functions around the M2000 core, and integrated and validated the complete chip'.

'Both we and the customer's design team take more than a little satisfaction from the fact that the first silicon is operational'.

Reblewski also announced the company plans to open its first North American office in Silicon Valley later this month to provide sales and support for its expanding customer base.

The FlexEOS range of embedded FPGA cores are SRAM based, and can be dynamically reconfigured to change the functionality of ASIC and SoC circuits after silicon processing and packaging.

FlexEOS macros are suitable for a wide range of applications, and can be supplied for any silicon foundry technology.

FlexEOS macros are currently characterised and manufactured in 90nm CMOS technology.

The silicon density for logic functions is up to 1350 LUTs per square millimetre, and the delay representing the LUT plus its interconnect portion is 0.372ns.

Each macro is delivered with a comprehensive software tool suite for the compilation of the applications which are to run on the macro.

M2000's range of FlexEOS products has been available for some time in 130nm technology, and is now available for production in 90nm.

Evaluation versions of the software are available from M2000.

The comprehensive pricing structure, which can be tailored to individual requirements, includes a licence fee for each project, and royalties on production chips.

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