Precision resistor networks use tantalum ultride
Tantalum ultride provides superior corrosion resistance to traditional nichrome films, as well as enhanced precision and stability.
In response to customers demands for increased stability, higher precision resistors, IRC Advanced Film Division has developed a family of precision resistor networks using tantalum ultride technology.
Consisting of the SON-U, DIP-U, SIP-U and PFC-UD Series devices, the networks are constructed using IRC's tantalum ultride film material on high purity alumina substrates.
"Our ultraprecision high-stability tantalum ultride film material was developed from our proprietary tantalum nitride (TaNFilm) formulation", says Jerry Seams, Applications Engineering Manager for IRC Advanced Film Division.
"Tantalum ultride provides superior corrosion resistance to traditional nichrome films, as well as enhanced precision and stability".
"In addition, the tantalum ultride networks are constructed with no internal solder connections, so they are not susceptible to dendritic growth".
The ultra precision networks are ideal for medical applications, including CT machines, MRI, PET and ultrasound equipment; petrochemical exploration and data logging instruments; instrumentation and test instruments including DMMs, measurement bridges, strain gauge circuits and input attenuators; as well as missile guidance and military avionics.
The DIP and SIP networks feature a resistance range of 1 to 100kohm with a resistor element power rating of 40mW at 70C.
The SON and PFC-UD networks are offered in a resistance range of 1 to 50kohm, with a resistor element power rating of 25mW at 70C.
All four high-stability networks feature absolute TCR to +/-10ppm/C and tracking TCR to +/-1ppm/C, with a voltage coefficent of 0.1ppm/V maximum.
Absolute tolerance is to +/-0.02% and ratio tolerance is to +/-0.01%.
Operating temperature range is from -55 to +125C.
The networks are all custom devices and pricing and lead times vary as to the complexity of the device.
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