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Flomerics

Address:
81 Bridge Road
Hampton Court
KT8 9HH
UK
Telephone: (UK) +44 20 8941 8810

http://www.flomerics.com

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Listing of all 118 news releases from Flomerics:

Thermal simulation helps platform beat ATCA specs

 User application article   Design team leader claims that thermal simulation is like having X-ray vision.  Brochure available  

News from Flomerics ( 6 August 2008)

Thermal simulation cuts potting costs in half

 User application article   The Flopack web-based wizard quickly produces accurate models of integrated circuits and other components.  Brochure available  

News from Flomerics (10 July 2008)

Software helps deal with growing heat problem

 User application article   The Redback SE1200 platform contains a total of 12 line cards, whose power dissipation is substantially higher than the previous-generation product.  Brochure available  

News from Flomerics (26 June 2008)

CFD software solves LED heat problem

 User application article   Voxdale engineers used the CFD results to redesign the housing in just one day to improve airflow, which eliminated overheating and increased light output and life to the desired levels.  Brochure available  

News from Flomerics (18 June 2008)

Thermal software gets thumbs up

 User application article   Flotherm provides tools that allow users to assemble models from libraries, avoiding the need to create them from scratch.  Brochure available  

News from Flomerics (12 June 2008)

Software workshops ease heat problems

Flomerics' workshops will explain how to simulate the thermal performance of an existing or planned data centre configuration using templates and libraries.  Brochure available  

News from Flomerics (21 May 2008)

Thermal software speeds custom heatsink design

 User application article   Crane Mechanical Engineer Mark Resler simulated a range of different heatsink configurations using thermal simulation software.  Brochure available  

News from Flomerics (16 May 2008)

Thermal simulation removes basestation hotspot

 User application article   Improved cooling scheme first modelled using thermal simulation software enables more powerful amplifiers to be placed in compact enclosures.