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Product category: Intellectual Property Cores
News Release from: Denali Software
Edited by the Electronicstalk Editorial Team on 6 February 2007

Programme eases Flash device integration

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Spansion has joined the Denali Software Memory Vendor Programme, providing chip designers with high-quality simulation models to efficiently deploy Spansion Flash devices into all electronic designs

Spansion has joined the Denali Software Memory Vendor Programme (MVP), providing chip designers with high-quality simulation models and other engineering resources to efficiently deploy Spansion Flash devices into all electronic designs. 'Spansion is committed to providing innovative system-level solutions that bring added value to our customers', said Robert France, Vice president of Corporate System Engineering at Spansion.

'With Denali's high-quality tools, we are able to speed time to market and enable even earlier development cycles for our customers'.

In close collaboration with leading memory vendors, Denali's MVP creates a support ecosystem which delivers up-to-date information on Spansion's memory device technology, product roadmaps and vendor capability.

Benefit highlights of the MVP ecosystem include: an extensive database, including simulation models for MirrorBit Flash memory and other specifications and memory.

Also, other available resources include an online publication, the 'Denali memory report', which contains market information, profiles, pricing trends, and product roadmaps for Spansion's latest Flash memory technology and opportunities to participate in the industry's largest conference series, MemCon, which is targeted at bringing together chip designers, leading memory vendors and other leading companies in the value chain.

'We are very pleased to be working with the world's largest pure-play provider of Flash memory solutions', said Kevin Silver, Vice President of Marketing at Denali.

'Spansion offers a compelling roadmap for high-density Flash memory, and through the Memory Vendor Programme, we are able to work together to enable fast and efficient deployment of this technology into new product designs'.

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