APEX recognition for Via Fill process
The IPC Association has recently commended DEK's technological advances with its new Via Fill process
Awarded a slot in the Innovative Technology Showcase at the APEX exhibition in Anaheim, California, DEK's 100% fill technology was described by the judges as "groundbreaking". "Like most of our products, the Via Fill process was developed in response to customer requirements. We're delighted that it has been recognised as cutting-edge technology by the IPC Association and believe that our broad-ranging customer base will continue to inspire further technological advances at DEK", a DEK representative commented.
As part of the Innovative Technology Showcase at APEX, DEK's Via Fill process that delivers 100% fill of substrate vias with no voids and minimal surface residue, demonstrated what the IPC described as "new and emerging technologies".
This ProFlow-based process offers solutions to problems such as insufficient fill, voiding, poor throughput and excessive handling of product associated with conventional methods.
The fully enclosed ProFlow head is used in conjunction with a dedicated tooling fixture that ensures complete fill of vias in the minimum of print passes (typically two), with a paste pressure of 2.5bar and a print speed of 25mm/s.
In addition, the print material has been shown to have a life of over three months in the transfer head.
Traditional manual or squeegee-based systems are not only far less clean and operator-friendly, but they typically take multiple passes to push material into vias.
They can also use a vacuum table to pull material through, resulting in both voids and inadequate deposition.
With results in throughput of over fives times faster than traditional squeegee-based fill processes, the Via Fill system is highly repeatable and offers greater accuracy.
Cost savings resulting from increased utilisation of manpower and considerably reduced wastage are also realised, while process control is significantly enhanced.
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