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Product category: Intellectual Property Cores
News Release from: ARC International
Edited by the Electronicstalk Editorial Team on 24 July 2002

Hynix joins ARC's SoC alliance

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Hynix Semiconductor is expanding its design services IP portfolio by offering ARC's 32bit RISC/DSP ARCtangent microprocessor core architecture in hard macro IP form

Hynix Semiconductor is expanding its design services IP portfolio by offering ARC's industry-leading 32bit RISC/DSP ARCtangent microprocessor core architecture in hard macro IP form. Hynix's customers are assured reduced development costs and faster time-to-market for highly differentiated SoC designs.

"We are delighted to have ARC International as a Hynix SoC Alliance partner.

Our alliance will help catalyse more business opportunities for joint customers in designing and manufacturing tomorrow's advanced SoC solutions using ARC's industry-leading IP.

With ARC's IP leadership, Hynix looks forward to increasing the total number of customer designs using this path to silicon", said Channy Lee, vice president and general manager of Hynix's semiconductor manufacturing Service (SMS) Division responsible for foundry, ASIC and COT services.

Hynix's design services include a growing portfolio of third party semiconductor IP, as well as library cells, analogue IP and embedded memory blocks developed in-house.

As one of the top four semiconductor foundries in the world, Hynix is fully leveraged to provide a lower risk and cost effective development environment ranging from initial design to final silicon.

"ARC International's alliance with Hynix provides chip designers the best of both worlds, industry-leading SoC IP for highly differentiated designs combined with superior fabrication and manufacturing capabilities", commented Mike Gulett, president and chief executive of ARC International.

"In addition to providing Hynix customers with high performance building blocks for communications and consumer product semiconductors, this alliance expands ARC International's role in Asia and narrows the production gap between silicon manufacturing and leading OEM product manufacturing centres in the region".

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