Product category: Design and Development Software
News Release from: Ansoft Europe | Subject: Advanced Semiconductor Engineering IC Packaging so
Edited by the Electronicstalk Editorial Team on 8 November 2004

IC packaging partnership
proves a success

Register for the FREE Electronicstalk email newsletter now! News about Design and Development Software and more every issue. Click here for details.

IC packaging leader Advanced Semiconductor Engineering has announced its commitment to Ansoft's HFSS, Q3D Extractor and AnsoftLinks simulation products for IC packaging design and model extraction

ASE's standardisation on Ansoft extends their existing investment and commitment to Ansoft solutions. "Demanding customers like IDM rely on ASE to provide leading-edge IC packaging solutions". "These customers require high-performance package designs that operate reliably up to Gigahertz frequencies", said Dr Sung-Mao Wu, Electrical Lab Manager at ASE.

"We rely on Ansoft products to design these packages and ensure that the electrical performance requirements of our customers are met".

"The application of Ansoft tools arms us with the best solution and gives us an advantage over our competitors".

ASE uses HFSS, Q3D Extractor, TPA and AnsoftLinks to analyse complex high-speed and high-frequency packaging structures including quad flatpack (QFP), ball grid arrays (BGA), pin grid arrays (PGA) and chip scale packages (CSP).

In addition, Ansoft products are used to design controlled impedance transmission lines, both single-ended and coupled, that exist within the packages.

Electrical models produced by Ansoft's software products are delivered to ASE's customers so that precise circuit performance can be determined prior to production.

Furthermore, optimisation of the package design can be performed in software to provide optimal system performance.

"We are very pleased to have a close partnership with ASE for IC package simulation and design", said Charles Lee, Country Manager/Director of Business Development for Ansoft Taiwan.

"This relationship drives us to continue to develop our electromagnetic technology in order to meet leading-edge packaging design requirements vital to ASE and their end customers".

? Ansoft Europe: contact details and other news
? Email this article to a colleague
? Register for the free Electronicstalk email newsletter
? Electronicstalk Home Page

Related Business News

Icoa Is Partnering With Anchorfree To...
...Enhance And Monetize Thousands Of Wi-fi Hotspots. Icoa, Inc., a national provider of wireless broadband Internet access and managed network services in high-traffic public locations, and AnchorFree Inc., a rapidly growing Wi-Fi community powered by advertising, have announced today that they are partne

Eds Sales Take A Tumble
Dave Friedlos, Computing , Thursday 17 May 2007 at 00:00:00 But experts say downturn may reflect market weakness, writes Dave Friedlos Outsourcing giant EDS has released disappointing first-quarter figures showing slower growth and fewer con

Sweet specialist sees growth spurt
Lara Williams, Computing , Thursday 17 May 2007 at 00:00:00 Confectionary company IT infrastructure overhaul accommodates rapid growth Confectionery supplier Bon Bon Buddies has overhauled its IT infrastructure to cope with rapid growth whic

Canon takes a better picture of its supply chain
Lara Williams , Computing , Thursday 17 May 2007 at 00:00:00 Imaging specialist improves sales forcasting by 20 per cent Imaging specialist Canon has improved the accuracy of product sales forecasting by more than 20 per cent using supply ch

The greenest computer company under the Sun

Search the Pro-Talk network of sites