Product category: Analogue and Mixed Signal ICs
News Release from: Analog Devices | Subject: ADG3308
Edited by the Electronicstalk Editorial Team on 7 June 2004

Translator switch speaks
many different voltages

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The ADG3308 is the first in a new series of digital switches that allow a single IC to provide bidirectional data transfer and voltage translation

Its eight channels allow a mix of simultaneous read and write functions with bidirectional data transfer to provide designers greater flexibility and efficiency over traditional bus switches that require separate read/write cycles. The ADG3308's advanced circuit integration also reduces design work and saves board space, making it an ideal solution for portable consumer applications such as cell phones and notebook computers.

The ADG3308 guarantees direct data transfer between devices operating from supplies as different as 1.2 and 5.5V.

This large voltage translation range allows analogue or digital devices having widely differing logic levels to communicate seamlessly in the smallest possible board area without losing data.

Designers can use a mix of high- and low-voltage circuitry in an application without requiring complex translation solutions that involve many discrete components.

For example, a 1.5V ASIC can easily communicate with a 3.3V DAC when the ADG3308 is placed between the devices in the signal chain.

Unlike current solutions, the ADG3308 does not require a DIR pin to select the data direction the device, allowing simultaneous read and write signals for more efficient data communication.

Available in smaller LFCSP (lead frame chip scale packaging) options, the ADG3308 has tristate switching on both input and output to provide greater design flexibility.

The ADG3308 is well suited for applications involving data transfer between a low-voltage DSP/controller and a higher-voltage communication device such as a cellphone, PDA or notebook computer.

The ADG3308 is available in 20-lead TSSOP (thin shrink small outline package) and 4 x 4mm LFCSP (lead frame chip scale package) packages.

Pricing per unit in 1000-piece quantities is $1.60.

Samples are available now, with full production scheduled for July 2004.

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