FPGAs to gain green package options
Actel has unveiled its roadmap to offer "green" packaging options for its ProASIC 500K, ProASIC Plus, eX and SX-A field-programmable gate array (FPGA) families by the end of 2002
Expanding on the company's environment-conscious, lead-free packaging solutions announced earlier this year, Actel has unveiled its roadmap to offer "green" packaging options for its ProASIC 500K, ProASIC Plus, eX and SX-A field-programmable gate array (FPGA) families by the end of 2002. The company also disclosed plans to deliver "green" packaging solutions for its remaining antifuse- and Flash-based FPGA product families by the end of 2003.
Actel defines a "green" package as one free of lead, halogenated compounds and antimony oxides.
An alternative to standard, lead-based packages, the "green" packaging option demonstrates the company's continuing commitment to market innovative products that comply with global environmental initiatives aimed at the replacement of lead in the manufacturing process of electronic devices.
Japan, the first country to manufacture lead-free assemblies, requires all semiconductors manufactured in that country to have lead-free packaging.
The majority of Japanese-based companies insist that vendors comply with these regulations.
Environment-conscience initiatives in Europe and the USA are gaining momentum as well.
Europe's WEEE Directive mandates the replacement of lead in electrical and electronic equipment by 1st January 2008, a deadline recently delayed by one year.
While the USA.
has no pending legislation to ban lead, the Computer Hazardous Waste Infrastructure Program (CHIP), which promotes the recycling of electronic products, is currently under consideration.
"The increased use of integrated circuits, coupled with shortened product life cycles, has raised concerns about the disposal of electronic components and its impact on the environment", said Barry Marsh, vice president, product marketing at Actel.
"As a result, nations worldwide are working to establish initiatives within the electronics industry to eliminate the use of lead and other alloys used in the manufacturing process that prove harmful to the environment long-term.
Today, Actel is reaffirming its commitment to environmentally friendly packaging by disclosing its roadmap to deliver "green" packaging to its customers for their communications, consumer, industrial and avionics applications".
"Green" packages for the company's ProASIC 500K, ProASIC Plus, eX and SX-A FPGA families are expected to be available by the end of 2002, with both lead-free and "green" packaging solutions for Actel's remaining product families expected by the end of 2003.
Both lead-free and "green" packaging options are offered at the same competitive prices as Actel's standard products.
Actel will continue to offer multiple package options for all its device families.
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