IC and hybrid processing equipment

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Latest articles from 'IC and hybrid processing equipment'

News releases from this sub-category

Showing 1-25 of 228 articles

SPP supplies Pegasus DSi Deep Silicon etch system

SPP Process Technology Systems (SPTS) has received an order for a Pegasus DSi Deep Silicon etch system, supported on the Omega FXP cluster platform, for a 3D-IC through silicon via (TSV) application.

News from SPP Process Technology Systems, Jun 2, 2010

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SM packages suit optical devices in aerospace apps

Stratedge's SM range of packages fits aerospace, avionics, automotive and telecom-industry applications, and is especially suited for LEDs, MEMS and optical devices.

News from Stratedge, May 31, 2010

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Nanofab tool influences nanostructure growth

Oxford Instruments Plasma Technology (OIPT), has launched the Nanofab800Agile System.

News from Oxford Instruments Plasma Technology, Sep 7, 2009

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DEK introduces wafer-processing system

DEK has developed the Galaxy thin silicon wafer processing system.

News from DEK, Aug 4, 2009

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Oxford Instruments releases HVPE reactor

Oxford Instruments has launched Crystalflex, a multi-wafer hydride vapour-phase epitaxy (HVPE) reactor.

News from Oxford Instruments Plasma Technology, May 18, 2009

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Atmel develops cryptographic authentication ICs

Atmel Corporation has announced its AT88SA range of low-cost, ultra-low power, super-secure cryptographic authentication ICs.

News from Atmel Corporation, Apr 30, 2009

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Oxford Instruments produces semi-polar GaN layers

The technical team at Oxford Instruments-TDI, led by Dr Alexander Usikov, is working closely with a light-emitting diode (LED) manufacturer to make semi-polar GaN layers for optoelectronic devices.

News from Oxford Instruments Plasma Technology, Mar 12, 2009

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ALD tool improves solar cells

Researchers have developed a thin-film coating providing an unparalleled level of surface passivation of crystalline silicon solar cells, using Oxford Instruments' FlexAL ALD tool.

News from Oxford Instruments Plasma Technology, Feb 18, 2009

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TDI advances HVPE technology

TDI, an Oxford Instruments company, has recently advanced the Hydride Vapour Phase Epitaxy (HVPE) technology to the growth of InGaN.

News from Oxford Instruments Plasma Technology, Oct 24, 2008

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SAFC launches high-purity halide range

SAFC Hitech has introduced a line of high-purity halides, which will enable the growth of scintillation detector crystals.

News from SAFC Hitech, Oct 21, 2008

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Challenger promotes circular connector range

Challenger Components is promoting the Ecomate circular connector series from Amphenol-Tuchel Electronics.

News from Challenger Components, Oct 10, 2008

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Module advances chemical vapour etching

Breakthrough chamber design and improved wafer handling makes XeF2 a viable process for high volume production.

News from Surface Technology Systems, Aug 4, 2008

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High-power green lasers help make solar cells

The Starlase range now addresses a multitude of applications on commonly used substrates including those used in the manufacture of solar cells.

News from Powerlase, Jul 31, 2008

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Ion beam tools explained

Ion beam technology tool offerings are suitable for both R and D and batch production capabilities.

News from Oxford Instruments Plasma Technology, Jul 28, 2008

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Wire bonder offers extended table travel

The Bondjet BJ820 platform handles 12.5 to 85um diameter wire bonding and ribbon bonding from 6 x 35 to 25 x 250um.

News from Hesse & Knipps, Jul 28, 2008

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Gas delivery improves LCD manufacture

The VHF is specifically designed to address the needs of IC, PV and thin-film transistor liquid crystal display manufacturers.

News from Air Products, Jul 23, 2008

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System provides fine vapour control

EpiVapor provides gas phase delivery of chemical vapours such as trimethylgallium (TMG) and trimethylaluminium (TMA) directly to multiple deposition tools in a safe, reproducible fashion.

News from SAFC Hitech, Jun 3, 2008

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Strip systems target both ends of IC market

Dry strip and clean systems address high throughput and low defectivity requirements for Flash, DRAM and logic applications.

News from Novellus Systems, May 20, 2008

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Wedge bonder handles varied wires

The Bondjet BJ820 handles all challenging fine pitch wire bonding applications in a single platform, including RF and microwave devices, COB, MCM and hybrids, fibre optics and automotive applications.

News from Hesse & Knipps, May 8, 2008

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Flying probes promote precision trimming

Laser trimming systems for capacitors and resistors use flying probes for feedback rather than fixed probe cards for economical operations on small batches.

News from LS Laser Systems, Apr 14, 2008

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Lasers boost semiconductor research

The Powerlase lasers will enable the development of the DPP source for lithography steppers, which are used for the fabrication of semiconductors.

News from Powerlase, Apr 10, 2008

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Silicon engineering to upgrade DRAM production

MST for CMOS will improve overall chip performance and reduce static power without introducing any new materials into existing manufacturing process flows.

News from Mears Technologies, Mar 21, 2008

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Wire bonders move to next generation

Series offers higher accuracy over a larger bondable area, and represents the most technologically advanced assembly equipment in the market.

News from Kulicke and Soffa Industries, Mar 18, 2008

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Process tool systems ordered for research complex

Nine systems will provide University of Southampton with leading-edge capabilities in the research and development of novel nanoelectronic, MEMS and photonic devices.

News from Oxford Instruments Plasma Technology, Dec 20, 2007

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Dry etch deprocessing is enhanced

Plasma Accelerator delivers increased etching speeds, superior duplication rates, straightforward operation and low damage.

News from Oxford Instruments Plasma Technology, Dec 5, 2007

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Showing 1-25 of 228 articles

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