Heatsinks and thermal management
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Latest articles from 'Heatsinks and thermal management'
News releases from this sub-category
Showing 1-25 of 214 articles
Laird Technologies has announced the release of its outdoor thermoelectric cooler series with bi-polar thermostatic control.
News from Laird Technologies, Dec 24, 2010
EMI shielding for medical device enclosures
Chomerics Europe - a division of Parker Hannifin - has launched Soft-Shield 4850, an EMI shielding material that is suitable for medical applications using electronics equipment for patient care.
News from Chomerics, Nov 19, 2010
Mosfet packaging features top-side cooling
In order to meet the needs for high current capability, high efficiency and smaller form factors, Fairchild Semiconductor has developed the Dual Cool packaging for Mosfets.
News from Fairchild Semiconductor, Oct 29, 2010
Amec Thermasol has launched a range of micro porous ceramic heat sinks (MPCHS) for high-volume applications such as LED/LCD TVs, computer monitors, set-top boxes, motherboards, media players and more.
News from Amec Thermasol, Sep 30, 2010
Laird Technologies has released the Tflex XS400 series thermal gap filler designed for telecom, IT, consumer, automotive, LED and power supply applications.
News from Laird Technologies, Sep 23, 2010
Laird unveils Cascade TEAs for wireless products
Laird Technologies has released its enhanced Cascade Series Thermoelectric Assemblies (TEAs) for advanced electronics and wireless products.
News from Laird Technologies, Aug 11, 2010
Heater extends operating temperature of LCDs
Therma Klear transparent heaters from Dontech are said to be ideal for applications including avionics displays, vehicle displays, mobile computers, kiosks and handheld devices.
News from Dontech, Jul 21, 2010
Thermal-Clad HPL simplifies design and assembly
Bergquist's HPL dielectric for thermal-clad substrates is optimised for high-power LED lighting and other applications requiring enhanced heat-transfer efficiency.
News from Bergquist, May 14, 2010
Sharp LEDs offer 40,000-hour service life at +80C
All light-emitting diodes (LEDs) from Sharp Microelectronics have a specified service life of 40,000 operating hours at a substrate temperature of +80C.
News from Sharp Microelectronics, Apr 8, 2010
ATS heat sinks cool ICs in low-airflow conditions
Advanced Thermal Solutions has introduced a line of lower-height Maxiflow heat sinks for cooling ICs and other hot components in narrow packaging and low-airflow-velocity conditions.
News from Advanced Thermal Solutions, Jan 14, 2010
EMKA releases fire-resistant self-adhesive gaskets
EMKA has announced that its 1016 self-adhesive gasket is available in fire-resistant versions to UL94 VO and 94HB ratings, and in EMC formats to address electrical and magnetic interference.
News from EMKA UK, Jan 5, 2010
Laird modifies TEAs with cross-flow technology
Laird has released its modified Tunnel Series Thermoelectric Assemblies (TEAs), designed with a cross-flow technology to maximise heat transfer when pulling air through a heat exchanger.
News from Laird Technologies, Dec 15, 2009
Gap fillers suit silicone-sensitive applications
MHandW International has added TP-S3LS ultra-low-silicone gap fillers to its line of thermal interface materials.
News from MH and W, Oct 23, 2009
Schroff dehumidifier protects from condensation
Schroff has launched a dehumidifier system that is designed to remove moisture from the air within an enclosure to protect electronic and electrical components from condensation.
News from Schroff UK, Oct 12, 2009
Winshield C is chemical and scratch resistant
Chomerics Europe, a division of Parker Hannifin, has introduced Winshield C, a shielded window display material that is said to offer a range of benefits compared with existing solutions.
News from Chomerics Europe, Sep 22, 2009
Crydom offers range of SSR/heat-sink assemblies
Crydom, a unit of Custom Sensors and Technologies (CST) and a specialist in solid-state-relay (SSR) technology, has introduced a line of heat sinks and SSR/heat-sink assemblies and accessories.
News from Crydom International, Aug 3, 2009
Laird Technologies has announced the introduction of its modified Air-to-Air outdoor thermoelectric cooler assemblies.
News from Laird Technologies, Jul 27, 2009
Emerson Network Power has announced Liebert CRV, a new precision cooling unit designed for servers located in the server rooms and data centres of SMBs.
News from Emerson Network Power Adaptive Power and Cooling, Jul 24, 2009
Chomerics unveils Therm-A-Gap T652 gap filler
Chomerics Europe, a division of Parker Hannifin, has introduced a thermally conductive dispensable gap filler that results in much lower stress being exerted on delicate components.
News from Chomerics Europe, Jun 24, 2009
Bergquist has introduced its T-Clad metal-core PCB circuits pre-applied with Bond-Ply 450 adhesive tape.
News from Bergquist Company, Feb 23, 2009
MHandW offers nanocrystalline cores
MHandW has unveiled nanocrystalline cores for use as common-mode chokes to reduce the build volume of damaging motor bearing currents in high-power inverters and turbine generator drives.
News from MH+W International Corporation, Feb 6, 2009
Chomerics releases Cho-Seal 1270
Chomerics Europe, a division of Parker Hannifin, has introduced an ultra-soft moulded elastomer EMI shielding gasket.
News from Chomerics Europe, Jan 14, 2009
MH and W launches Keratherm interface material
Keratherm U 90 thermal interface material is designed for use where contamination concerns prohibit the use of silicone-based thermal pads, but where high levels of thermal conductivity are needed.
News from MH+W International Corporation, Dec 24, 2008
Chomerics adds materials to range
Chomerics Europe has added materials to its range of electrically conductive form-in-place (FIP) gaskets.
News from Chomerics Europe, Dec 17, 2008
Bergquist releases thermal-clad IMS
The Bergquist Company has introduced ready-to-use thermal-clad insulated metal substrates (IMS) in standard star, square, array or strip formats.
News from Bergquist Company, Dec 12, 2008
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