An Electronicstalk guide
Start with the news release Self-protected MOSFETs for automotive applications from Diodes Incorporated, which we summarised at the time by saying "Suiting automotive and industrial applications, Diodes Incorporated's new self-protected MOSFETs are suitable for switching inductive loads, such as motors, relays and lamps at low frequencies. ". Several months prior to that, we featured the news release Compact linear regulator with thermal resistance from Linear Technology: "Linear Technology has produced a wider-temperature-range version of the LT3010, a high-voltage, micropower linear regulator for avionics, military, industrial, automotive, RF and telecom applications.".
In December 2010, we covered the news from Rogers - take a look at Rugged flame-retardent laminates for military PCBs which says: "Rogers has introduced XT/duroid high-performance thermoplastic laminate materials, suitable for high-frequency multilayer circuits in military, aerospace and deep-space applications.".
Take a look also at the news release from Allegro Microsystems, Sensor IC withstands harsh automotive environments, as well as Globtek offers desktop-style power supplies from Globtek, and HTC material for low loss in high-power circuits from Rogers.
Offline switcher IC eliminates no-load waste (December 2010)
Power Integrations has introduced the Linkzero-LP, a highly integrated offline switcher IC targeting chargers and adapters up to 3.2W for portable devices such as mobile phones and toothbrushes.
Connector system for engine control units and more (December 2010)
Molex has introduced its CMX sealed, hybrid, high-density and modular connector system, which utilises the CTX terminal system and is suitable for transportation powertrain applications.
PCE-5125 board ideal for industrial applications (December 2010)
Advantech has introduced the PCE-5125 PICMG 1.3 form-factor single-host board, designed with the Intel Q57/3450 Express platform for industrial applications that require high computing power.
Lord introduces SC-305 silicone encapsulant (December 2010)
Lord has announced the availability of Lord SC-305, a thermally conductive silicone encapsulant designed for encapsulation applications where high heat dissipation is required.
100V MOSFETs launched for space applications (December 2010)
IR has launched a range of hermetic radiation-hardened 100V MOSFETs in a compact, surface-mount SMD0.2 package for space applications such as satellite bus power systems and payload power supplies.
Synchronous buck regulator for POL applications (December 2010)
The SC185 synchronous buck regulator is suited for power-efficient POL regulation applications in storage, networking, communications, consumer, industrial and office automation equipment.
Step-down converters suit automotive applications (December 2010)
The MAX16903 and MAX16904 automotive-grade synchronous step-down converters are designed to withstand extreme battery-voltage conditions in automotive applications.
Clamshells safeguard PCBs in defence applications (December 2010)
Schroff has introduced a range of VPX clamshells that safeguard printed circuit boards in the extreme environmental conditions associated with defence applications.
- Adhesive has high thermal conductivity
The Liqui-Bond SA 1800 screen-printable thermal-interface adhesive from Bergquist combines high thermal conductivity with low viscosity.
Flip-chip underfill boosts thermal conductivity
Specifically formulated material increases reliability of in-package and chip-on-board applications by increasing the thermal dissipation from the die into the substrate.
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