?Printed Circuit Board?
An Electronicstalk guide
Start with the news release TMPM36x microcontrollers for embedded applications from Toshiba Electronics, which we summarised at the time by saying "Toshiba Electronics Europe has expanded its range of high-performance 32-bit ARM Cortex-M3 microcontrollers with devices for embedded applications such as office equipment and industrial control.". Several months prior to that, we featured the news release ZMD offers I/O channel for automation applications from ZMD: "ZMD has added the ZIOL2201 high-voltage I/O channel, which meets the physical layer requirements of sensor/actuator systems used in factory automation, to its line driver and level shifter I/O range.".
In February 2011, we covered the news from Texas Instruments - take a look at TLC59282 driver for LED display applications which says: "Texas Instruments has introduced a serial-controlled, 16-channel constant-current sink LED driver that is said to simplify design in LED display applications such as video displays and message boards.".
Take a look also at the news release from Excelsys Technologies, Ultra-compact LEDs for space-critical applications, as well as Converter modules for transportation systems from Power Sources Unlimited, and OKW extends range of pocket-size enclosures from OKW Enclosures.
Devices replace Hall encoders in brushless motors (February 2011)
The iC-LTA/iC-PT series of monolithically integrated speed and commutation encoders replace Hall encoders in brushless motors.
Linear Technology launches supercapacitor chargers (February 2011)
Linear Technology has introduced two new two-cell supercapacitor chargers for addressing high peak power, data backup and 'dying gasp' needs in portable and data storage applications.
DC/DC converters for telecommunications use (February 2011)
Mornsun has introduced the WRA/WRB-LT-3W series of surface-mount DC/DC converters for a variety of applications, including instrumentation, industrial controls and telecommunications.
HSIC technology delivers low power consumption (February 2011)
Evatronix has announced the introduction of a High-Speed Inter-Chip (HSIC) compatible PHY IP for power and area savings in USB 2.0 chip-to-chip connections.
Low-profile interconnect has high current density (February 2011)
Molex's new version of its Extreme Ten60Power high-current connector delivers up to 260A per linear inch, offering maximum current-to-space ratio that is suitable for space-constrained applications.
PoL DC/DC converters suit data communications (February 2011)
Murata Power Solutions has introduced the OKL-T/1-W12 to its Okami series of point of load (PoL) DC/DC converters for embedded applications such as powering on-board ICs in wireless equipment.
Intermediate bus converter optimises energy use (February 2011)
Campbell Collins now offers Ericsson Power Modules' BMR453 and BMR454, a pair of energy-optimised intermediate bus converters that are suitable for low-profile, convection-cooled applications.
Ultra-broadband capacitor suits test equipment (February 2011)
AVX has worked with Modelithics to create a surface-mount chip capacitor model for its GX02 broadband capacitor series that addresses DC blocking issues from 16kHz (-3dB roll-off) to 65GHz.
- Rittal subracks house printed circuit boards
Rittal's range of subracks, all branded under the Ripac banner, provide users with multiple options for housing several printed circuit boards or plug-in modules in a 19in rack environment.
- DEK OTS clamping secures printed circuit boards
DEK has launched its Over Top Snuggers (OTS) substrate clamping technology.
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