Cooling Buffer | Decrease Temperature After Reflow Oven

BF-350C Cooling Buffer

Smooth transmission of heavy PCBs.
Three operation modes: FIFO, LIFO, By-pass
Fast cooling effect: decreasing the temperature of PCB boards quickly
Adopt side storage of board to enhance cooling function and increase the number of storage.

Customization is always available, please mark down your need when contact us.

PCB Flipping Machine

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Description	Cooling buffer used after oven or before AOI
Cycle time	Approx. 10seconds
Maximum PCBs capacity	20pcs (support customization)
Power supply	AC 110/220 volts; single phase
Power	Max. 300VA
Transport height	900 +/- 20mm (support customization)
Transport direction	L to R/R to L

Model	Dimension (LxWxH, mm)	PCB board size (LxWxH, mm)	Weight (kg)
BF-350C	150014951760	150150-1200350	300

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We help you avoid the pitfalls to deliver the quality and value your PCBA solutions, on-time and on-budget.