Automatic BGA Rework Station

1. Integrated Heads Design

• Hot airhead and mounting head integration design, with auto soldering and desoldering functions.

2. Lead-free Hot-air & Infrared Mix Design

• The hot air system at the upper part has fast heating, uniform temperature, and fast cooling (the temperature can drop by 50-80 degrees when cooling), which better meets the process requirements of lead-free soldering.
• The lower heating temperature zone is heated by a mixture of infrared and hot air. Infrared rays directly work on the heating area and conduct at the same time as the hot air. This can make up for the mutual insufficiency and make the PCB heat up quickly (heating rate up to 10°C/S), while the temperature remains uniform.

4. High-precision Slider

• PCB board adopts high accuracy slider to make sure the mount precision of BGA and PCB.

5. Unique Bottom Preheating Table

• Unique bottom preheating platform that is made of Germany-imported excellent quality heating materials (infrared gold-plated light tube) and anti-glare thermostatic glass (temperature resistance up to 1800℃) preheating area up to 500*420mm

6. X, Y-Axis Motor Control

• X, Y-axis adopts the automatic motor control movement method, which makes the alignment fast and convenient, and the equipment space is fully utilized. The large-area PCB rework is realized with a relatively small equipment volume.
• The maximum clamping size can reach 510*480mm, and there is no dead corner for rework.

Specification

Dimension