Semi-Auto BGA Machine2020-09-14T05:29:19+00:00
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BGA Machine BRS-41O For Rework – Semi Auto Type


Basic Description

This BGA machine is widely used in applications such as motherboard, LED lighting product, power supply PCB board repair, and rework. Equipped with 3-zone of independently heating system, it has a temperature control accuracy within one degree Celsius.

Moreover, it has a high degree of automation with many intelligent designs. For example, the automatic optical alignment system, temperature alarm system, heater height adjustment, etc. Besides, adopting an intelligent temperature curve real-time display, temperature tested, and revised by the three sensors, the heater efficiency is further improved.

What’s more, it supports up to 5 operating modes, which can be applied in terms of the actual requirements. And it adopts 6 segments of constant temperature heating, which improves the success rate of chips repair.

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Feature

1. Precision Optical Alignment System

  • It is equipped with the CCD color optical alignment system which has a function of high definition, beam split, amplification, lessening, fine adjustment, and autofocus. Also, it has the function including the automatic color aberration resolution and brightness adjustment, adjustable image contrast;
  • It has a 15-inch high-pixel LCD monitor and is applicable for micro-adjustment.

2. Muti-functional & Humanized Operation System

  • Adopting the HD touch screen interface; the upper heating head and mounting head designed 2 in 1. Besides, it can provide various BGA tuyeres that are made of the titanium alloy, which can be rotated in any degrees for easy installation and replacement.
  • The axis of X, Y, and R angle adopted micrometer fine-tuning, accurately locating, which can reach ±0.01mm.

3. Independent Three Temperature Zone

  • There is a large infrared heater that can preheat the board at the bottom and avoid the deformation of PCB board during transformation;
  • The heaters located at the top or bottom can be worked separately and freely combined with lower energy heating elements.
  • Built-in high-precision k-type thermocouple closed-loop control and PID parameter self-tuning system;
  • Equipped with different sizes of nozzles;
  • The axis of X, Y, and R angle adopted micrometer fine-tuning, accurately locating, which can reach ±0.01mm.

4. Machine External Parts

  • It adopts the intelligent external parts, which ensure a high-efficient of working performance.

5. Machine Outlet Operating System

  • Adopting the real-time visualized temperature curve display function, and sensors used to revise the temperature. Also, the distance between the bottom nozzle and the PCB board is adjustable, which ensures an excellent heating performance.

6. High-Precision Temperature Control System

  • It adopts touch screen interface with PLC control, and displays six temperature curves at any time (there are respectively upper heating curve, lower heating curve, preheating temperature zone curve, and other three external curves)
  • It has eight-stage constant temperature heating control, completely simulate the reflow soldering process to ensure the improvement of soldering yield, and the temperature is accurately controlled at +1℃.
  • There are three external temperature measurement ports, which are mainly used for BGA chip temperature curve adjustment.

7. Three Temperature Zone

  • It adopts touch screen interface with PLC control, and displays six temperature curves at any time (there are respectively upper heating curve, lower heating curve, preheating temperature zone curve, and other three external curves)
  • It has eight-stage constant temperature heating control, completely simulate the reflow soldering process to ensure the improvement of soldering yield, and the temperature is accurately controlled at +1℃.
  • There are three external temperature measurement ports, which are mainly used for BGA chip temperature curve adjustment.

8. Intelligent Storage Function of Air Volume

  • The air volume of the machine can be saved along with the temperature curve, and the air volume of different sizes can be set for chips of different sizes.
  • The BGA machine can store hundreds of temperature curve parameters. The temperature curve can be analyzed, set, and changed at any time on the touch screen.
  • The alignment lens can be automatically moved in and out with a high degree of automation, which can avoid manual operation errors.

9. Automatic Temperature Alarm System

  • BRS-410 BGA Machine has an alarm function after desoldering. In the case of temperature out of control, the circuit can automatically power off and over-temperature protection, with dual over-temperature protection functions

10. High-accuracy Optical Vision Alignment System

  • It adopts a high-precision optical vision alignment system with functions such as zooming in and out, auto-focusing, and a 15-inch color LCD monitor.
  • The degree of automation is high, which can avoid human error, and can achieve unique results for the repair of lead-free processes, pop and sealing components

11. PCB Protection Function

  • It has a high-sensitivity photoelectric switch, which can prevent the heating head from crushing the PCB motherboard during the machine operation.

12. Five Working Modes Available

  • The machine is used the integrated design of upper heating head and placement head. With the five working modes of automatic welding, automatic removal, automatic placement, semi-automatic, and manual, it can freely switching functions, which can meet the different needs of special products.

Specification

Power SupplyAC 110V/220V+/-10%; 50/60Hz
Total PowerMax. 6400W
Heater PowerTop heater (hot air) 1200W; bottom heater(hot air) 1200W; bottom heater(infrared) 4000W
PCB Size410x380mm - 10x10 mm
BGA Chip Size70x70mm - 1x1 mm
Applicable PCB Thickness0.3 - 5mm
Sensor3pcs
Mounting Accuracy+/- 0.01mm
Alignment SystemOptical lens + HD industrial camera
Locating WayV shape PCB support + external universal fixture + laser light for centering and positioning
Temperature ControlHigh precision K-sensor + closed loop control + independent temp. controller (the precision can reach +/-1 degree celsius)
Electrical MaterialDriving motor + smart temp. controller + color touch screen
Tin Spot MonitoringOptional external camera to monitor solder ball melting process during welding
Working ModesFive: Semi-auto/Manual/Remove/Mount/Weld

Dimension

Dimension (LxWxH,mm)600x640x850
Weight (Kg)60

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